Provides packaging, assembly, and reliability testing services to ensure robust, high‑performance photonic devices for industrial use.
Develop packaging concepts for fibre coupling, thermal management and electrical interconnects tailored to your application.
Prototype robust, scalable photonic packages using advanced assembly and bonding techniques.
Evaluate optical coupling efficiency, thermal performance and mechanical stability.
Create functional packaged modules to validate system-level integration.
Perform environmental and lifetime testing (temperature, humidity, vibration) to ensure industrial-grade durability.